Dr. Mengdi Han is an Assistant Professor in the Department of Biomedical Engineering, College of Future Technology, Peking University. He received his B.S. degree in Huazhong University of Science and Technology in 2012 and Ph.D. degree in Peking University in 2017. He was a visiting Ph.D. student at Department of Materials Science and Engineering, University of Illinois Urbana-Champaign from 2015 to 2017. He worked as a postdoctoral fellow at Querrey Simpson Institute for Bioelectronics, Northwestern University from 2017 to 2020. He published more than 100 SCI-indexed papers, including first/corresponding author papers in Nature Electronics, Nature Biomedical Engineering, Science Translational Medicine, Science Robotics, Science Advances, PNAS, Advanced Materials, etc. His research group aims to develop advanced micromechanical bioelectronics for electronic skins, wireless biosensors and microrobotics. His research has been recognized with many awards including Microsystems & Nanoengineering Young Scientist Award (2020), MIT Technology Review Innovators Under 35 Asia Pacific (2021), World’s Top 2% Scientists by Stanford & Elsevier (2023), iCANX Young Scientist Award (2024), and Asian Young Scientist Fellowship (2024).

韩梦迪，北京大学未来技术学院生物医学工程系助理教授，研究员，博士生导师，入选国家级海外高层次人才计划青年项目。2012年本科毕业于华中科技大学电子科学与技术系，2017年博士毕业于北京大学微纳电子学系；2015-2017年作为联合培养博士生就读于美国伊利诺伊大学材料科学与工程系，2017-2020年于美国西北大学Querrey Simpson生物电子研究所从事博士后研究。已发表SCI论文百余篇，其中第一/通讯作者论文发表于Nature Electronics、Nature Biomedical Engineering、Science Translational Medicine、Science Robotics、Science Advances、PNAS、Advanced Materials等期刊。获Microsystems & Nanoengineering 青年科学家（2020）、《麻省理工科技评论》亚太地区35岁以下科技创新35人（2021）、世界顶尖2%科学家（2023）、iCANX青年科学家（2024）、亚洲青年科学家（2024）等奖励及荣誉。韩梦迪课题组致力于研发微机械生物电子器件，助力电子皮肤、无线生物传感、微型机器人等领域的发展。