Mengdi Han Research Group
Lab of Micromechanical Bioelectronics
(韩梦迪课题组 微机械生物电子实验室)
- …
Mengdi Han Research Group
Lab of Micromechanical Bioelectronics
(韩梦迪课题组 微机械生物电子实验室)
- …
Mengdi Han Research Group
Lab of Micromechanical Bioelectronics
(韩梦迪课题组 微机械生物电子实验室)
Electronic Skin
Electronic skins consist of soft, ultrathin, and elastic sensor arrays capable of measuring electrical, thermal, mechanical, chemical, and other types of signals. Their unique form factor allows for intimate and conformal lamination onto almost any curvilinear surface, including but not limited to essential organs of the human body, robots, and minimally invasive surgical tools. Our group develops 3D micromechanical bioelectronics to enhance the capabilities of electronic skins in tactile sensing. The 3D geometry increases the degree of freedom in deformation, thereby enabling the measurement of triaxial force and many other complex tactile information. We innovate advanced manufacturing approaches that can construct 3D micromechanical bioelectronics across various scales, and apply such devices in biomedicine and robotics.
Representative Publications
C Xu¹, Y Wang¹, J Zhang, J Wan, Z Xiang, Z Nie, J Xu, X Lin, P Zhao, Y Wang, S Zhang, J Zhang, C Liu, N Xue, W Zhao, M Han*
Science Advances 2024, 10, eadp6094.
J Kwak¹, M Han¹, Z Xie, HU Chung, JY Lee, R Avila, J Yohay, X Chen, C Liang, M Patel, I Jung, J Kim, M Namkoong, K Kwon, X Guo, C Ogle, D Grande, D Ryu, DH Kim, S Madhvapathy, C Liu, DS Yang, Y Park, R Caldwell, A Banks, S Xu, Y Huang, S Fatone, JA Rogers*
Science Translational Medicine 2020, 12, eabc4327.
M Han¹, L Chen¹, K Aras¹, C Liang, X Chen, H Zhao, K Li, NR Faye, B Sun, W Bai, JH Kim, Q Yang, Y Ma, E Song, JM Baek, Y Lee, C Liu, JB. Model, G Yang, R Ghaffari, Y Huang*, IR. Efimov*, JA Rogers*
Nature Biomedical Engineering 2020, 4, 997-1009. (Featured as the Cover)
[News & Views in Nature Biomedical Engineering], [Preview in Matter]
M Han¹, H Wang¹, Y Yang, C Liang, W Bai, Z Yan, H Li, Y Xue, X Wang, B Akar, H Zhao, H Luan, J Lim, I Kandela, GA Ameer, Y Zhang*, Y Huang*, JA Rogers*
Nature Electronics 2019, 2, 26-35. (Featured as the Cover)
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