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Mengdi Han Research Group

Lab of Micromechanical Bioelectronics

 

(韩梦迪课题组 微机械生物电子实验室)

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      • HOME
      • RESEARCH 
        • OVERVIEW
        • ELECTRONIC SKIN
        • WIRELESS BIOSENSOR
        • MICROROBOTICS
      • GROUP 
        • CURRENT
        • ALUMNI
      • PUBLICATIONS 
        • 2025
        • 2024
        • 2023
        • 2022
        • 2021
        • 2020
        • 2010s
        • FULL LIST
        • COVERS
      • NEWS 
        • 2025
        • 2024
        • 2023
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        • 2021
        • 2020
      • CONTACT
      • JOIN US

    Mengdi Han Research Group

    Lab of Micromechanical Bioelectronics

     

    (韩梦迪课题组 微机械生物电子实验室)

      • HOME
      • RESEARCH 
        • OVERVIEW
        • ELECTRONIC SKIN
        • WIRELESS BIOSENSOR
        • MICROROBOTICS
      • GROUP 
        • CURRENT
        • ALUMNI
      • PUBLICATIONS 
        • 2025
        • 2024
        • 2023
        • 2022
        • 2021
        • 2020
        • 2010s
        • FULL LIST
        • COVERS
      • NEWS 
        • 2025
        • 2024
        • 2023
        • 2022
        • 2021
        • 2020
      • CONTACT
      • JOIN US
      • …  
        • HOME
        • RESEARCH 
          • OVERVIEW
          • ELECTRONIC SKIN
          • WIRELESS BIOSENSOR
          • MICROROBOTICS
        • GROUP 
          • CURRENT
          • ALUMNI
        • PUBLICATIONS 
          • 2025
          • 2024
          • 2023
          • 2022
          • 2021
          • 2020
          • 2010s
          • FULL LIST
          • COVERS
        • NEWS 
          • 2025
          • 2024
          • 2023
          • 2022
          • 2021
          • 2020
        • CONTACT
        • JOIN US

      Mengdi Han Research Group

      Lab of Micromechanical Bioelectronics

       

      (韩梦迪课题组 微机械生物电子实验室)

      • Electronic Skin

        Electronic skins consist of soft, ultrathin, and elastic sensor arrays capable of measuring electrical, thermal, mechanical, chemical, and other types of signals. Their unique form factor allows for intimate and conformal lamination onto almost any curvilinear surface, including but not limited to essential organs of the human body, robots, and minimally invasive surgical tools. Our group develops 3D micromechanical bioelectronics to enhance the capabilities of electronic skins in tactile sensing. The 3D geometry increases the degree of freedom in deformation, thereby enabling the measurement of triaxial force and many other complex tactile information. We innovate advanced manufacturing approaches that can construct 3D micromechanical bioelectronics across various scales, and apply such devices in biomedicine and robotics.

        3D piezoelectric filaments

        Integration with surgical tools

        Wireless electronic skin for prosthetics

        Compatible with micro- and macroelectronics

      • Representative Publications

        (4) Three-dimensional micro strain gauges as flexible, modular tactile sensors for versatile integration with micro- and macroelectronics

        C Xu¹, Y Wang¹, J Zhang, J Wan, Z Xiang, Z Nie, J Xu, X Lin, P Zhao, Y Wang, S Zhang, J Zhang, C Liu, N Xue, W Zhao, M Han*

        Science Advances 2024, 10, eadp6094.

         

        (3) Soft, wireless electronic system for continuous, multimodal measurements of physiological health at the skin interface with prostheses

        J Kwak¹, M Han¹, Z Xie, HU Chung, JY Lee, R Avila, J Yohay, X Chen, C Liang, M Patel, I Jung, J Kim, M Namkoong, K Kwon, X Guo, C Ogle, D Grande, D Ryu, DH Kim, S Madhvapathy, C Liu, DS Yang, Y Park, R Caldwell, A Banks, S Xu, Y Huang, S Fatone, JA Rogers*

        Science Translational Medicine 2020, 12, eabc4327.

         

        (2) Catheter-integrated soft multilayer electronic arrays for multiplexed sensing and actuation during cardiac surgery

        M Han¹, L Chen¹, K Aras¹, C Liang, X Chen, H Zhao, K Li, NR Faye, B Sun, W Bai, JH Kim, Q Yang, Y Ma, E Song, JM Baek, Y Lee, C Liu, JB. Model, G Yang, R Ghaffari, Y Huang*, IR. Efimov*, JA Rogers*

        Nature Biomedical Engineering 2020, 4, 997-1009. (Featured as the Cover)

        [News & Views in Nature Biomedical Engineering], [Preview in Matter]

         

        (1) Three-dimensional piezoelectric polymer microsystems for vibrational energy harvesting, robotic interfaces and biomedical implants

        M Han¹, H Wang¹, Y Yang, C Liang, W Bai, Z Yan, H Li, Y Xue, X Wang, B Akar, H Zhao, H Luan, J Lim, I Kandela, GA Ameer, Y Zhang*, Y Huang*, JA Rogers*

        Nature Electronics 2019, 2, 26-35. (Featured as the Cover)

        [News & Views in Nature Electronics]

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        Mengdi Han Research Group
        Mengdi Han Research Group, 韩梦迪课题组 Department of Biomedical Engineering, College of Future Technology, Peking University
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